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Additively Manufactured Electronics
High fidelity active electronic and electromechanical subassemblies are integral enablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. They necessitate iterative development, IP safety, fast time-to-market and device performance gains, thereby mandating AME for in-house, rapid prototyping and production.
Nano Dimension machines serve cross-industry needs by depositing proprietary consumable conductive and dielectric materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, and transformers and electromechanical components, to function at unprecedented performance. Those turn-key systems bridge the gap between PCB and semiconductor Integrated Circuits.
A revolution at the click of a button: From CAD to a functional high- performance AME device in hours, solely at the cost of the consumable materials.
DragonFly IV
Build, Test, and Iterate Electronics in a Single Day!
A multi-material, multi-layer 3D printer that generates entire circuits in one step — including substrate, conductive traces, and passive components.
Design Flexibility Beyond Traditional Boundaries
A completely new way to build electronics.
Freedom in Three Dimensions
Layouts can now make connections in any 3D direction.
Novel Form Factors
FLIGHT software allows for new shapes in electro-mechanical CAD.
FLIGHT Plan
3D Data Preparation
Turn your PCB into any 3D geometry.
FLIGHT Check
Design Verification
Verify your 3D design manufacturability.
FLIGHT Control
Print Preparation
Optimize your AME process.
Pair with our FLIGHT software
Contact us for more information:
Dimensions
1,400mm x 800mm x 1,800mm
Weight
520kg (1,150lbs)
Power Supply
230VAC, 20A, 50-60Hz
Network Connectivity
Ethernet TCP/IP 10/100/1000
Operational Humidity
Above 35% non-condensing
Operational Temperature
Between 18°C (64°F) - 28°C (82°F)
Regulatory Compliance
UL, CE, FCC
Deposition Technology
Piezo drop-on-demand inkjet
Number of Printheads
2, one for each ink: conductive and dielectric
Software
FLIGHT Software Suite (Design, Verification, Pre-Production)
Build Volume
160mm x 160mm x 3mm
Inks
Optimised silver nano particles and dielectric inks
Supported File Formats
All major ECAD and MCAD software, ODB++, Gerber & Excellon, STL
Resolution
18 µm (x), 18 µm (y), 10 µm (z)
Min. Line/Space
75 µm traces / 100 µm spacing
Min. BGA Pitch
350 µm
Min. Via
150 µm
Min. Dielectric Layer
Thickness
10.0 µm
Min. Conductive Layer Thickness
1.18 µm
Conductivity (Relative to Copper)
)30% ±5%
Dielectric Constant (Dk) @ 2 GHz/15 GHz
2.77 / 2.78
Tangential Loss (Df) @ 2 GHz/15 GHz
0.015 / 0.018
1,400mm x 800mm x 1,800mm
230VAC, 20A, 50-60Hz
Ethernet TCP/IP 10/100/1000
%35 üzeri, buğusuz
18°C (64°F) - 28°C (82°F) arası
UL, CE, FCC
Piezo drop-on-demand inkjet
2, iletken ve dielektrik mürekkepler için birer tane
FLIGHT Software Suite (Design, Verification, Pre-Production)
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