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Digital Industry Solutions
for Electronics

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Türkiye

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Additively Manufactured Electronics

High fidelity active electronic and electromechanical subassemblies are integral enablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. They necessitate iterative development, IP safety, fast time-to-market and device performance gains, thereby mandating AME for in-house, rapid prototyping and production.

Nano Dimension machines serve cross-industry needs by depositing proprietary consumable conductive and dielectric materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, and transformers and electromechanical components, to function at unprecedented performance. Those turn-key systems bridge the gap between PCB and semiconductor Integrated Circuits.

A revolution at the click of a button: From CAD to a functional high- performance AME device in hours, solely at the cost of the consumable materials.

DragonFly IV

Build, Test, and Iterate Electronics in a Single Day!

A multi-material, multi-layer 3D printer that generates entire circuits in one step — including substrate, conductive traces, and passive components.

Design Flexibility Beyond Traditional Boundaries

A completely new way to build electronics.

Freedom in Three Dimensions

Layouts can now make connections in any 3D direction.

Novel Form Factors

FLIGHT software allows for new shapes in electro-mechanical CAD.

FLIGHT Plan

3D Data Preparation

Turn your PCB into any 3D geometry.

FLIGHT Check

Design Verification

Verify your 3D design manufacturability.

FLIGHT Control

Print Preparation

Optimize your AME process.

Pair with our FLIGHT software

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Contact us for more information:

Topic/Product

Dimensions

1,400mm x 800mm x 1,800mm

Weight

520kg (1,150lbs)

Power Supply

230VAC, 20A, 50-60Hz

Network Connectivity

Ethernet TCP/IP 10/100/1000

Operational Humidity

Above 35% non-condensing

Operational Temperature

Between 18°C (64°F) - 28°C (82°F)

Regulatory Compliance

UL, CE, FCC

Deposition Technology

Piezo drop-on-demand inkjet

Number of Printheads

2, one for each ink: conductive and dielectric

Software

FLIGHT Software Suite (Design, Verification, Pre-Production)

Build Volume

160mm x 160mm x 3mm

Inks

Optimised silver nano particles and dielectric inks

Supported File Formats

All major ECAD and MCAD software, ODB++, Gerber & Excellon, STL

Resolution

18 µm (x), 18 µm (y), 10 µm (z)

Min. Line/Space

75 µm traces / 100 µm spacing

Min. BGA Pitch

350 µm

Min. Via

150 µm

Min. Dielectric Layer
Thickness

10.0 µm

Min. Conductive Layer Thickness

1.18 µm

Conductivity (Relative to Copper)

)30% ±5%

Dielectric Constant (Dk) @ 2 GHz/15 GHz

2.77 / 2.78

Tangential Loss (Df) @ 2 GHz/15 GHz

0.015 / 0.018

  • 1,400mm x 800mm x 1,800mm

  • 520 kg (1,150 lbs)

  • 230VAC, 20A, 50-60Hz

  • Ethernet TCP/IP 10/100/1000

  • %35 üzeri, buğusuz

  • 18°C (64°F) - 28°C (82°F) arası

  • UL, CE, FCC

  • Piezo drop-on-demand inkjet

  • 2, iletken ve dielektrik mürekkepler için birer tane

  • FLIGHT Software Suite (Design, Verification, Pre-Production)

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